Settle3 Featured

Settle3 is a dynamic 3D soil settlement program designed to help you analyze vertical consolidation and settlement under foundations. Settle3 can be used for applications including embankments and foundations.

You can quickly create complex soil profiles and loading conditions, and view results in three dimensions. Modeling can be staged, and time-dependent consolidation analysis can be performed including primary and secondary consolidation (creep) at user-defined time intervals. Linear and non-linear materials can be modeled. Groundwater elevation can be staged, and horizontal and vertical drainage conditions can be specified.

Settlement Analysis

Perform soil settlement analysis to evaluate immediate settlement, primary consolidation and secondary settlement of embankments, foundations and surface loads. Easily create soil profiles using RSLog, CPT boreholes with soil classification, or the section creator feature to generate models efficiently

Ground Improvement

Get more flexibility over ground improvement methods like soil replacement, vibro-compaction, or stone columns, which can be applied to regions with different staging at different depths. Sensitivity analysis is also available for settlement analysis with ground improvement properties such as stiffness, top depth, bottom depth, spacing etc.

CPT & Liquefaction Analysis

Perform CPT analysis and Liquefaction analysis together with each other or as standalone modules. Get 29 different parameter results for CPT analysis. Liquefaction results can be calculated based on Standard Penetration Test (SPT), Cone Penetration Test (CPT), or Shear Wave Velocity (VST) data. Various triggering and post-triggering methods are also available in Settle3.

Integrations

Settle3-RSLog

Import borehole data from RSLog directly into Settle3 which can be used to quickly define your soil layers and material properties, without manually inputting data. You can also import field test data (e.g. SPT blow counts) directly from RSLog into your Settle3 project.